Title :
Characterization of metal-in-elastomer connector contact material
Author_Institution :
AT&T Bell Lab., Columbus, OH, USA
Abstract :
A technology assessment of new materials that may be useful in the future for interconnection devices, such as connectors, is presented. The work comprises two parts: characterization of Au- or Ag-plated Ni spheres in a silicon polymer matrix, and characterization of gold-capped Ni wires embedded in a silicone polymer matrix. In a silicone polymer matrix, embedded gold-plated metal wires or aligned gold-plated nickel spheres have the unique property of being electrically conductive in the Z-direction (thickness) while maintaining high insulation resistance in the X and Y directions. These materials can be used as an interface for anisotropic electric conduction between metallic elements. Contact resistance distributions as a function of probe area and geometry, load-displacement-resistance, stiffness, and mixed gas test are reported. The data relate to the evaluation of new materials and designs for interconnects in the 80 to 100 per inch range
Keywords :
electric connectors; gold; materials testing; nickel; printed circuit accessories; Ag plated Ni spheres; Au plated Ni spheres; Au plated Ni wires; anisotropic electric conduction between metallic elements; characterization; connectors; geometry; interconnection devices; load-displacement-resistance; metal-in-elastomer connector contact material; mixed gas test; new materials; probe area; silicon polymer matrix; stiffness; technology assessment; Cable insulation; Conducting materials; Connectors; Contacts; Dielectrics and electrical insulation; Inorganic materials; Nickel; Polymers; Silicon; Wires;
Conference_Titel :
Electrical Contacts, 1989., Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on
Conference_Location :
Chicago, IL
DOI :
10.1109/HOLM.1989.77930
