Characterization of metal-in-elastomer connector contact material

A technology assessment of new materials that may be useful in the future for interconnection devices, such as connectors, is presented. The work comprises two parts: characterization of Au- or Ag-plated Ni spheres in a silicon polymer matrix, and characterization of gold-capped Ni wires embedded in a silicone polymer matrix. In a silicone polymer matrix, embedded gold-plated metal wires or aligned gold-plated nickel spheres have the unique property of being electrically conductive in the Z-direction (thickness) while maintaining high insulation resistance in the X and Y directions. These materials can be used as an interface for anisotropic electric conduction between metallic elements. Contact resistance distributions as a function of probe area and geometry, load-displacement-resistance, stiffness, and mixed gas test are reported. The data relate to the evaluation of new materials and designs for interconnects in the 80 to 100 per inch range