• DocumentCode
    2985871
  • Title

    Alternative temperature chamber designs based on recirculating cooler technology

  • Author

    Bodah, James M. ; Cianciolo, Salvatore

  • Author_Institution
    Textron Syst., USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    75
  • Lastpage
    84
  • Abstract
    Conventional temperature chambers rely upon heat convection to transition product across a temperature range. Several are used at Textron Systems. In general, these chambers are costly, have a large footprint, and are incompatible with temperature sensitive test equipment, such as CCD cameras and optical detectors. An alternative heat conduction technology, based upon a recirculating cooler, should be considered when cost, size or temperature sensitivity of test equipment is a concern. Compared to a conventional temperature chamber, a recirculating cooler based design may reduce the system cost and size by a factor of two or more. Additionally, a recirculating cooler based design provides thermal isolation for test equipment that´s not in contact with the device under test (DUT). This paper discusses two different recirculating cooler temperature chamber designs. Detailed calculations are given for the first design, which is operational. Highlights are given for the second design, a system that´s under construction
  • Keywords
    automatic test equipment; environmental testing; heat conduction; integrated circuit manufacture; integrated circuit testing; production testing; ATE stations; Textron Systems; heat conduction technology; recirculating cooler technology; system cost; temperature chamber designs; temperature sensitivity; thermal isolation; Automatic testing; Cooling; Costs; Heat transfer; Optical design; Optical detectors; System testing; Temperature distribution; Temperature sensors; Test equipment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electro/99 Technical program, 1999. Proceedings of the
  • Conference_Location
    Boston, MA
  • Print_ISBN
    0-7803-5475-3
  • Type

    conf

  • DOI
    10.1109/ELECTR.1999.779331
  • Filename
    779331