Title :
New type of large-area a-Si module produced using a polymer encapsulation method
Author :
Hayashi, Katsuhiko ; Ishikawa, Atsuo ; Endho, Toshihito ; Yamagish, Hideo
Author_Institution :
Labs. of Electron. Mater. Res., Kaneka Corp., Shiga, Japan
Abstract :
A new type of amorphous silicon (a-Si) solar module has been developed, the back surface of which is encapsulated with a thermosetting polymer by using a spreading method. For this purpose, poly-olefin oligomer was chosen as an encapsulation layer and the process has been investigated. The modules show very little change in electrical performance under several types of acceleration test
Keywords :
amorphous semiconductors; elemental semiconductors; encapsulation; life testing; polymers; semiconductor device testing; silicon; solar cell arrays; solar cells; Si; a-Si solar cells; acceleration test; back surface; electrical performance; large-area PV modules; poly-olefin oligomer; polymer encapsulation method; spreading method; thermosetting polymer; Conductivity; Costs; Encapsulation; Glass; Laboratories; Photovoltaic cells; Polymer films; Silicon; Substrates; Testing;
Conference_Titel :
Photovoltaic Energy Conversion, 1994., Conference Record of the Twenty Fourth. IEEE Photovoltaic Specialists Conference - 1994, 1994 IEEE First World Conference on
Conference_Location :
Waikoloa, HI
Print_ISBN :
0-7803-1460-3
DOI :
10.1109/WCPEC.1994.520016
