Title :
Emerging trends in modeling IC packages in CFD
Author_Institution :
Flomerics Inc., USA
Abstract :
The authors have acquired detailed models of many package types. The models are both computationally efficient and commercially acceptable. Rapid acceleration of technology adoption is foreseen
Keywords :
computational fluid dynamics; integrated circuit modelling; integrated circuit packaging; CFD; IC modeling; IC packages; computationally efficient models; package types; technology adoption; Computational fluid dynamics;
Conference_Titel :
Electro/99 Technical program, 1999. Proceedings of the
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-5475-3
DOI :
10.1109/ELECTR.1999.779353
