DocumentCode
2986313
Title
Emerging trends in modeling IC packages in CFD
Author
Cajina, R.
Author_Institution
Flomerics Inc., USA
fYear
1999
fDate
1999
Firstpage
137
Lastpage
163
Abstract
The authors have acquired detailed models of many package types. The models are both computationally efficient and commercially acceptable. Rapid acceleration of technology adoption is foreseen
Keywords
computational fluid dynamics; integrated circuit modelling; integrated circuit packaging; CFD; IC modeling; IC packages; computationally efficient models; package types; technology adoption; Computational fluid dynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electro/99 Technical program, 1999. Proceedings of the
Conference_Location
Boston, MA
Print_ISBN
0-7803-5475-3
Type
conf
DOI
10.1109/ELECTR.1999.779353
Filename
779353
Link To Document