Title :
Power dissipation in a vertically integrated chip-scale atomic clock
Author :
Kitching, John ; Knappe, Svenja ; Schwindt, Peter D.D. ; Shah, Vishal ; Hollberg, Leo ; Liew, Li-Anne ; Moreland, John
Author_Institution :
Time & Frequency Div., Nat. Inst. of Stand. & Technol., Boulder, CO, USA
Abstract :
The physics package of a vertically integrated chip-scale atomic clock, based on cesium, has recently been demonstrated at NIST. This device requires 69 mW of electrical power to maintain the vapor cell 34 K above the temperature of the baseplate. The physics package structure is analyzed by use of analytical thermal modeling and finite-element calculation. Improvements to the design are proposed to reduce the power consumption of the physics package alone to near 15 mW and of a full chip-scale atomic clock to below approximately 30 mW. Power consumption at this level will open the door to the use of atomic frequency references in portable, battery-operated applications such as wireless communications and global positioning.
Keywords :
atomic clocks; chip scale packaging; finite element analysis; frequency standards; 15 mW; 30 mW; 69 mW; Cs; MEMS; analytical thermal modeling; cesium clock; compact atomic frequency references; finite-element calculation; physics package power consumption reduction; portable battery-operated frequency references; vapor cell temperature; vertically integrated chip-scale atomic clock; Analytical models; Atomic clocks; Chip scale packaging; Energy consumption; Finite element methods; Frequency; NIST; Physics; Power dissipation; Temperature;
Conference_Titel :
Frequency Control Symposium and Exposition, 2004. Proceedings of the 2004 IEEE International
Print_ISBN :
0-7803-8414-8
DOI :
10.1109/FREQ.2004.1418566