Title :
Advanced automation techniques for interconnecting thin silicon solar cells
Author :
Nowlan, M.J. ; Hogan, S.J. ; Darkazalli, G. ; Sutherland, S.F. ; Breen, W.F. ; Murach, J.M. ; Patterson, J.S.
Author_Institution :
Spire Corp., Bedford, MA, USA
Abstract :
The objective of this work is to reduce the cost and improve the quality of terrestrial photovoltaic modules by developing automated high-throughput (5 MW/yr) processes for interconnecting thin silicon solar cells. New low-stress, high-throughput processes have been developed for cell loading, alignment, and inspection, interconnect ribbon handling, flux application, ribbon-to-cell soldering, cell string handling, and I-V testing of assembled cell strings. Both standard thickness (350 μm) and thin (200 μm) cells have been used to evaluate and refine these processes
Keywords :
elemental semiconductors; inspection; process control; semiconductor device manufacture; semiconductor device testing; silicon; solar cell arrays; solar cells; soldering; 200 mum; 350 mum; I-V testing; Si; alignment; automated high-throughput processes; flux application; inspection; interconnect ribbon handling; loading; manufacture; ribbon-to-cell soldering; solar cell interconnection; string handling; terrestrial photovoltaic modules; Assembly; Automation; Costs; Inspection; Photovoltaic cells; Photovoltaic systems; Silicon; Solar power generation; Soldering; Testing;
Conference_Titel :
Photovoltaic Energy Conversion, 1994., Conference Record of the Twenty Fourth. IEEE Photovoltaic Specialists Conference - 1994, 1994 IEEE First World Conference on
Conference_Location :
Waikoloa, HI
Print_ISBN :
0-7803-1460-3
DOI :
10.1109/WCPEC.1994.520088
