DocumentCode
2986929
Title
The Present State of the Art of Wide-Bandgap Semiconductors and Their Future
Author
Rosker, Mark J.
Author_Institution
Defense Adv. Res. Projects Agency, Arlington
fYear
2007
fDate
3-5 June 2007
Firstpage
159
Lastpage
162
Abstract
This paper summarizes recent improvements in the performance and reliability of microwave and millimeter-wave wide-bandgap gallium nitride on silicon carbide devices and their promise for future integrated circuits. Many recent advances have been made as a result of the on-going Phase II wide band gap semiconductor for RF applications (WBGS-RF) program funded by the Defense Advanced Research Projects Agency (DARPA). During Phase II of the program, significant progress has been made toward realizing wide-bandgap devices that provide outstanding performance at reliability levels that will allow their use in a wide variety of high power applications.
Keywords
MIMIC; silicon compounds; wide band gap semiconductors; GaN; RF Applications; SiC; integrated circuits; millimeter-wave wide-bandgap gallium nitride; reliability levels; silcon carbide devices; wide-bandgap semiconductors; Gallium nitride; HEMTs; III-V semiconductor materials; MMICs; Microwave devices; Power amplifiers; Semiconductor device reliability; Silicon carbide; Substrates; Wide band gap semiconductors; GaN; HEMT; MMIC; SiC; power amplifiers;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits (RFIC) Symposium, 2007 IEEE
Conference_Location
Honolulu, HI
ISSN
1529-2517
Print_ISBN
1-4244-0530-0
Electronic_ISBN
1529-2517
Type
conf
DOI
10.1109/RFIC.2007.380855
Filename
4266403
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