DocumentCode :
2986951
Title :
High-Q Integrated Inductor Using Post-CMOS Selective Grown Porous Silicon (SGPS) Technique for RFIC Applications
Author :
Li, Chen ; Liao, Huailin ; Wang, Chuan ; Yin, Jun ; Huang, Ru
Author_Institution :
Peking Univ., Beijing
fYear :
2007
fDate :
3-5 June 2007
Firstpage :
167
Lastpage :
170
Abstract :
This paper reports a new category of high-Q integrated inductor which is realized using post-CMOS selective grown porous silicon (SGPS) technique. The SGPS technique is used to effectively reduce low-resistivity silicon substrate loss. Different from other porous silicon (PS) based inductor techniques, this SGPS technique is completely post-CMOS based. The inductors are fabricated in standard RF CMOS process firstly and then Q-factors are improved through our proposed post-CMOS SGPS technique. For a 2.1 nH inductor fabricated in a standard 0.35 mum RF CMOS process, a 105% increase (from 9.5 to 19.4) in peak Q factor is obtained. Furthermore, a 2.45 GHz VCO using proposed SGPS inductor achieves 7.2 dBc phase noise improvement at 100 kHz frequency offset.
Keywords :
CMOS integrated circuits; Q-factor; inductors; phase noise; radiofrequency integrated circuits; voltage-controlled oscillators; Q-factor; RFIC application; VCO; high-Q integrated inductor; phase noise; post-CMOS SGPS technique; radiofrequency integrated circuits; selective grown porous silicon; standard RF CMOS process; voltage-controlled oscillator; CMOS process; High power amplifiers; Inductors; Phase noise; Q factor; Radio frequency; Radiofrequency integrated circuits; Silicon; Strips; Voltage-controlled oscillators; Post-CMOS; Q-factor; VCO; integrated inductor; phase noise; selective grown porous silicon (SGPS); substrate loss;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2007 IEEE
Conference_Location :
Honolulu, HI
ISSN :
1529-2517
Print_ISBN :
1-4244-0530-0
Electronic_ISBN :
1529-2517
Type :
conf
DOI :
10.1109/RFIC.2007.380857
Filename :
4266405
Link To Document :
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