• DocumentCode
    2987092
  • Title

    MPSoC Communication Architecture Exploration Using an Abstraction Refinement Method

  • Author

    Shen, Hao ; Pétrot, Frédéric

  • Author_Institution
    TIMA Lab., Grenoble
  • fYear
    2008
  • fDate
    4-8 Jan. 2008
  • Firstpage
    403
  • Lastpage
    408
  • Abstract
    The complexity of today´s Multi-Processors System-on-Chip (MPSoC) requires new design methodologies to solve time-to-market and design cost problems. In SoC for which several subsystems are connected together, we notice that lots of design time is wasted on solving the inter-subsystem (global) communication problem. In this paper, we propose a novel communication exploration method based on a multi-abstraction levels exploration. With this work, the inter-subsystem communication structure can be optimized at the beginning of the design process by using simulation models at three different abstraction levels. The simulation at the higher abstraction level allows designers to explore parameters of the interconnection model at the more detailed abstraction level. Some design loop cases can be avoided by using this exploration method. With the Motion-JPEG case study, we illustrate the whole communication exploration process step by step. From experimental results, we show that compared with the cycle accurate simulation, the inter-subsystem communication can be well optimized and evaluated at higher abstraction levels.
  • Keywords
    multiprocessing systems; system-on-chip; video coding; MPSoC communication architecture exploration; Motion-JPEG; abstraction refinement method; design cost problems; inter-subsystem communication problem; multiprocessors system-on-chip; time-to-market; Design methodology; Energy consumption; Hardware; Indium phosphide; Laboratories; Legged locomotion; Process design; Space exploration; Timing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2008. VLSID 2008. 21st International Conference on
  • Conference_Location
    Hyderabad
  • ISSN
    1063-9667
  • Print_ISBN
    0-7695-3083-4
  • Type

    conf

  • DOI
    10.1109/VLSI.2008.64
  • Filename
    4450534