• DocumentCode
    2987173
  • Title

    Single Event Upset: An Embedded Tutorial

  • Author

    Wang, Fan ; Agrawal, Vishwani D.

  • Author_Institution
    Auburn Univ., Auburn
  • fYear
    2008
  • fDate
    4-8 Jan. 2008
  • Firstpage
    429
  • Lastpage
    434
  • Abstract
    With the continuous downscaling of CMOS technologies, the reliability has become a major bottleneck in the evolution of the next generation systems. Technology trends such as transistor down-sizing, use of new materials, and system on chip architectures continue to increase the sensitivity of systems to soft errors. These errors are random and not related to permanent hardware faults. Their causes may be internal (e.g., interconnect coupling) or external (e.g., cosmic radiation). To meet the system reliability requirements it is necessary for both the circuit designers and test engineers to get the basic knowledge of the soft errors. We present a tutorial study of the radiation-induced single event upset phenomenon caused by external radiation, which is a major source of soft errors. We summarize basic radiation mechanisms and the resulting soft errors in silicon. Soft error mitigation techniques with time and space redundancy are illustrated. An industrial design example, the IBM z990 system, shows how the industry is dealing with soft errors these days.
  • Keywords
    integrated circuit design; integrated circuit reliability; radiation hardening (electronics); redundancy; silicon; CMOS technology reliability; circuit design; radiation-induced single event upset; silicon; soft errors mitigation; space redundancy; CMOS technology; Circuit faults; Circuit testing; Coupling circuits; Hardware; Integrated circuit interconnections; Single event upset; System-on-a-chip; Transistors; Tutorial;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2008. VLSID 2008. 21st International Conference on
  • Conference_Location
    Hyderabad
  • ISSN
    1063-9667
  • Print_ISBN
    0-7695-3083-4
  • Type

    conf

  • DOI
    10.1109/VLSI.2008.28
  • Filename
    4450538