CAD-oriented equivalent circuit modeling of on-chip interconnects for RF integrated circuits in CMOS technology

Author

Zheng, J. ; Hahm, Y.-C. ; Weisshaar, A. ; Tripathi, V.K.

Author_Institution

Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA

Volume

1

fYear

1999

fDate

13-19 June 1999

Firstpage

35

Abstract

A CAD-oriented modeling methodology for coupled interconnects on lossy substrates in CMOS technology is presented. The modeling technique is based on a quasi-static EM analysis and an equivalent circuit model extraction and model-order reduction procedure. The response of the SPICE compatible equivalent circuit models is in good agreement with the frequency-dependent transmission line characteristics of the interconnects.

Keywords

CMOS integrated circuits; SPICE; UHF integrated circuits; circuit CAD; equivalent circuits; field effect MMIC; integrated circuit interconnections; integrated circuit modelling; transmission line theory; CAD-oriented modeling methodology; CMOS technology; RF integrated circuits; RFIC; SPICE compatible models; circuit model extraction; coupled interconnects; equivalent circuit modeling; frequency-dependent transmission line characteristics; lossy substrate; model-order reduction procedure; onchip interconnects; quasi-static EM analysis; CMOS integrated circuits; CMOS technology; Coupling circuits; Equivalent circuits; Integrated circuit interconnections; Integrated circuit modeling; Radio frequency; Radiofrequency integrated circuits; Semiconductor device modeling; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1999 IEEE MTT-S International

Conference_Location

Anaheim, CA, USA

Print_ISBN

0-7803-5135-5

Type

conf

DOI

10.1109/MWSYM.1999.779419

Filename

779419