Exploring Temperature-Aware Design of Memory Architectures in VLIW Systems

Author

Ayala, José L. ; Apavatjrut, Anya ; Atienza, David ; López-Vallejo, Marisa

Author_Institution

Univ. Polytech. de Madrid, Madrid

fYear

2007

fDate

11-13 Jan. 2007

Firstpage

81

Lastpage

87

Abstract

This paper presents a thermal model to analyze the temperature evolution in the shared register files found on VLIW systems. The use of this model allows the analysis of several factors that have an strong impact on the heat transfer: layout topology, placement and memory accesses. Finally, some relevant conclusions are obtained after analyzing the thermal behavior of several multimedia applications.

Keywords

low-power electronics; memory architecture; thermal management (packaging); VLIW system; heat transfer; layout topology; memory access; memory architecture; multimedia application; placement factor; shared register file; temperature evolution; temperature-aware design; thermal model; Energy consumption; Hardware; Memory architecture; Power system modeling; Registers; Semiconductor device measurement; Telecommunication services; Temperature distribution; Topology; VLIW;

fLanguage

English

Publisher

ieee

Conference_Titel

Innovative architecture for future generation high-performance processors and systems, 2007. iwia 2007. international workshop on

Conference_Location

Maui, HI

ISSN

1537-3223

Print_ISBN

0-7695-3077-X

Type

conf

DOI

10.1109/IWIA.2007.7

Filename

4450646