Manufacturing semiconductor integrated circuits with built-in hermetic equivalent reliability

Author

Loboda, M.J. ; Camilletti, R.C. ; Goodman, L.A. ; White, L.K. ; Pinch, H.L. ; Wu, C.P.

Author_Institution

Dow Corning Corp., Midland, MI, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

897

Lastpage

901

Abstract

A new, thin film process for use in manufacturing high reliability integrated circuits is presented. Known as ChipSeal^TM inorganic coating technology, the approach produces the smallest realization of a completely packaged integrated circuit. Standard thin film processing and new silicon materials science has been combined to produce a hermetic equivalent, chip level package. This paper reviews the development of the thin film materials and their integration with the manufacture of silicon semiconductor devices. Reliability testing of chip scale packaged ICs is covered in detail

Keywords

integrated circuit manufacture; ChipSeal inorganic coating technology; Si; Si semiconductor devices; built-in hermetic equivalent reliability; chip level packaging; chip scale packaged ICs; reliability testing; semiconductor integrated circuits; thin film materials; thin film process; Coatings; Integrated circuit manufacture; Integrated circuit packaging; Integrated circuit reliability; Manufacturing processes; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor thin films; Silicon; Thin film circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.550752

Filename

550752