Title :
Manufacturing semiconductor integrated circuits with built-in hermetic equivalent reliability
Author :
Loboda, M.J. ; Camilletti, R.C. ; Goodman, L.A. ; White, L.K. ; Pinch, H.L. ; Wu, C.P.
Author_Institution :
Dow Corning Corp., Midland, MI, USA
Abstract :
A new, thin film process for use in manufacturing high reliability integrated circuits is presented. Known as ChipSealTM inorganic coating technology, the approach produces the smallest realization of a completely packaged integrated circuit. Standard thin film processing and new silicon materials science has been combined to produce a hermetic equivalent, chip level package. This paper reviews the development of the thin film materials and their integration with the manufacture of silicon semiconductor devices. Reliability testing of chip scale packaged ICs is covered in detail
Keywords :
integrated circuit manufacture; ChipSeal inorganic coating technology; Si; Si semiconductor devices; built-in hermetic equivalent reliability; chip level packaging; chip scale packaged ICs; reliability testing; semiconductor integrated circuits; thin film materials; thin film process; Coatings; Integrated circuit manufacture; Integrated circuit packaging; Integrated circuit reliability; Manufacturing processes; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor thin films; Silicon; Thin film circuits;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550752
