Title :
A Novel Readout Circuit Allowing Microbolometers to Operate without TEC
Author :
Yun Zhou ; Jian Lv
Author_Institution :
State key Lab. of Electron. Thin Film & Integrated Devices, Univ. of Electron. Sci. & Technol. of China (UESTC), Chengdu, China
Abstract :
This paper describes a new read-out IC (ROIC) architecture with substrate temperature compensation for the uncooled microbolometer detector. The influence of responsivity on the substrate temperature is evaluated. Numerical simulation and measurement of the proposed ROIC architecture demonstrate high quality of signal over wide temperature range without using multiple corrections. A 160 × 120 uncooled microbolometer focal plane array(FPA) based on the proposed circuit was implemented on silicon using a 0.5 μm CMOS technology. The measurement data show that the maximum difference of the output voltages is only 2mV over 20K substrate temperature change. This architecture is expected to allow removal of the thermoelectric cooler (TEC) from uncooled systems. Thus it is ideally suited for low-cost, low-power, and low-weight production applications.
Keywords :
CMOS integrated circuits; bolometers; focal planes; microsensors; numerical analysis; readout electronics; silicon; CMOS technology; FPA; ROIC architecture; low-weight production applications; numerical simulation; read-out IC architecture; readout circuit; size 0.5 mum; substrate temperature compensation; uncooled microbolometer detector; uncooled microbolometer focal plane array; Arrays; Bolometers; Resistance; Substrates; Temperature distribution; Temperature measurement; Temperature sensors; ROIC; TEC; low cost; microbolometer; uncooled;
Conference_Titel :
Control Engineering and Communication Technology (ICCECT), 2012 International Conference on
Conference_Location :
Liaoning
Print_ISBN :
978-1-4673-4499-9
DOI :
10.1109/ICCECT.2012.40
