Title :
Area array packaging technologies for high-performance computer workstations and multiprocessors
Author :
Chung, Tom C. ; Ghahghahi, Farshad ; Oberlin, Bill ; Carey, David ; Nelson, Dick
Author_Institution :
Tandem Comput. Inc., Cupertino, CA, USA
Abstract :
Tandem Computers Incorporated has been working with the Microelectronics and Computer Technology Corporation (MCC), along with its member companies, to actively develop area array packaging (AAP) related technologies for next-generation workstation/multiprocessor module packaging. Since 1990, Tandem has participated in several MCC projects, such as the Open Systems Project (OSP1), its follow-on (OSP2), and the Packaging for Parallel Processing (PPP) Project. In this paper, we discuss our AAP-related developmental findings, especially in the areas of ball grid arrays (BGAs), direct chip attach (DCA), and multichip module-laminate (MCM-L) related technologies, including packaging requirements; a trade-off study of a 300 MHz computer workstation; large, high-I/O BGA (up to 44 mm square, with 1089 I/Os) and DCA (up to 20 mm square, with ~2200 I/Os) technology developments; advanced MCM-L substrate technology; escape routing for AAP; BGA and DCA assembly technologies; characteristics of flip chip underfill performance; reliability modeling and testing results; and electrical signal integrity
Keywords :
flip-chip devices; integrated circuit packaging; microassembling; multichip modules; multiprocessing systems; reliability theory; surface mount technology; workstations; BGA; DCA assembly technology; MCM-L substrate technology; area array packaging technologies; ball grid arrays; direct chip attach; electrical signal integrity; escape routing; flip chip underfill performance; high-performance computer workstations; multichip module-laminate; multiprocessor module packaging; reliability modeling; reliability testing; Assembly; Electronics packaging; Grid computing; High performance computing; Microelectronics; Open systems; Operating systems; Parallel processing; Routing; Workstations;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550753
