Area array packaging technologies for high-performance computer workstations and multiprocessors

Author

Chung, Tom C. ; Ghahghahi, Farshad ; Oberlin, Bill ; Carey, David ; Nelson, Dick

Author_Institution

Tandem Comput. Inc., Cupertino, CA, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

902

Lastpage

910

Abstract

Tandem Computers Incorporated has been working with the Microelectronics and Computer Technology Corporation (MCC), along with its member companies, to actively develop area array packaging (AAP) related technologies for next-generation workstation/multiprocessor module packaging. Since 1990, Tandem has participated in several MCC projects, such as the Open Systems Project (OSP1), its follow-on (OSP2), and the Packaging for Parallel Processing (PPP) Project. In this paper, we discuss our AAP-related developmental findings, especially in the areas of ball grid arrays (BGAs), direct chip attach (DCA), and multichip module-laminate (MCM-L) related technologies, including packaging requirements; a trade-off study of a 300 MHz computer workstation; large, high-I/O BGA (up to 44 mm square, with 1089 I/Os) and DCA (up to 20 mm square, with ~2200 I/Os) technology developments; advanced MCM-L substrate technology; escape routing for AAP; BGA and DCA assembly technologies; characteristics of flip chip underfill performance; reliability modeling and testing results; and electrical signal integrity

Keywords

flip-chip devices; integrated circuit packaging; microassembling; multichip modules; multiprocessing systems; reliability theory; surface mount technology; workstations; BGA; DCA assembly technology; MCM-L substrate technology; area array packaging technologies; ball grid arrays; direct chip attach; electrical signal integrity; escape routing; flip chip underfill performance; high-performance computer workstations; multichip module-laminate; multiprocessor module packaging; reliability modeling; reliability testing; Assembly; Electronics packaging; Grid computing; High performance computing; Microelectronics; Open systems; Operating systems; Parallel processing; Routing; Workstations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.550753

Filename

550753