Title :
ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings. (IEEE Cat. No.03EX750)
Abstract :
The following topics are dealt with: packaging; technologies, industry and marketing; packaging design, modeling and simulation; packaging processes & equipments; assembly, interconnection and SMT.
Keywords :
electronics packaging; SMT; assembly; electronic packaging technology; interconnection; modeling; packaging design; packaging equipment; packaging processes; simulation;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298681
