Packaging R&D in Singapore

Author

Iyer, Mahadevan K. ; Siong, Teo Poi ; Hwa, Teo Keng ; Beng, Lim Thiam

Author_Institution

Inst. of Microelectron., Singapore, Singapore

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

21

Lastpage

23

Abstract

This paper gives an overview of electronic, optical and MEMS packaging activities in Singapore from both components and microsystems perspective. A brief introduction to Singapore´s electronic sector is provided. The research and development focus and industry collaborations are discussed. The collaborations between universities and research institutes of Singapore in the areas of system integration, electro optical module development, wafer level packaging and integration and MEMS packaging are discussed.

Keywords

electronics packaging; micromechanical devices; research and development; MEMS packaging; Singapore activities; business opportunities; components perspective; electronic packaging; electronics industry; electrooptical module development; industry collaborations; microsystems perspective; optical packaging; research and development; wafer level packaging; Assembly; Collaboration; Electronics industry; Electronics packaging; Industrial electronics; Micromechanical devices; Research and development; Semiconductor device manufacture; Semiconductor device packaging; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298686

Filename

1298686