Title :
Computer aided reliability assessment
Author :
Wu, Ji ; Pecht, Michael ; Wang, Jiaji
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
Abstract :
This paper describes the structure and operation of integrated software tools being developed at the CALCE Electronic Products and Systems Center which facilitate design-for-reliability and virtual qualification of electronic systems at the component and circuit card level.
Keywords :
electronic engineering computing; electronics packaging; failure analysis; reliability; software tools; computer aided reliability assessment; design-for-reliability; electronic system virtual qualification; failure mechanism models; integrated software tools; microelectronic packages; physics-of-failure methods; Circuits; Failure analysis; Geometry; Materials testing; Military standards; Packaging; Qualifications; Robustness; Software libraries; Stress;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298689
