Title :
A study of metallization processing ceramic package
Author :
Qingshui, Xia ; Chuanzheng, Tu ; Kai, Cheng ; Luning, Wang ; Liang, Fan Zheng
Author_Institution :
No.55 Inst. of China Electrics Technol. Group Corp., China
Abstract :
This paper introduces the metallization process in ceramic package and discusses some important factors in the process.
Keywords :
ceramic packaging; metallisation; sintering; thick films; airtightness; ceramic package; green ceramic; high-reliability high-power electronic devices; metal powder sintering; metallization process; multilayer ceramic; screen printing machine; Ceramics; Electronic packaging thermal management; Electronics packaging; Filling; Humidity; Metallization; Powders; Printing; Protection; Temperature;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298705
