مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

2989506

Title :

Dancing with bumping

Author :

Wu, Fei-Jain

Author_Institution :

Chipbond Technology Corporation

fYear :

2003

fDate :

28-30 Oct. 2003

Firstpage :

133

Lastpage :

140

Keywords :

Aging; Bonding; Costs; Gold; Packaging;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location :

Shanghai, China

Print_ISBN :

0-7803-8168-8

Type :

conf

DOI :

10.1109/EPTC.2003.1298709

Filename :

1298709

Link To Document :