DocumentCode

2989506

Title

Dancing with bumping

Author

Wu, Fei-Jain

Author_Institution

Chipbond Technology Corporation

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

133

Lastpage

140

Keywords

Aging; Bonding; Costs; Gold; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298709

Filename

1298709