Title :
Lasers in electronics packaging
Author :
Yunlong Sun ; Swenson, Edward
Author_Institution :
Electro Sci. Industries, Inc, Portland, OR, USA
Abstract :
Solid-state UV laser and CO/sub 2/ lasers are widely used in electronics packaging, including via formation on PCB, direct writing on PCB, via formation on silicon wafer and dicing of thin wafer, etc. This paper will review those applications and the technology trend in the area.
Keywords :
electronics packaging; gas lasers; laser beam machining; solid lasers; dicing; direct writing on PCB; electronics packaging; gas lasers; silicon wafer; soldering mask; solid-state UV laser; via formation on PCB; Copper; Dielectric materials; Electronics packaging; Optical pulses; Silicon; Solid lasers; Solid state circuits; Space vector pulse width modulation; Sun; Writing;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298716
