DocumentCode
2989681
Title
Lasers in electronics packaging
Author
Yunlong Sun ; Swenson, Edward
Author_Institution
Electro Sci. Industries, Inc, Portland, OR, USA
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
167
Abstract
Solid-state UV laser and CO/sub 2/ lasers are widely used in electronics packaging, including via formation on PCB, direct writing on PCB, via formation on silicon wafer and dicing of thin wafer, etc. This paper will review those applications and the technology trend in the area.
Keywords
electronics packaging; gas lasers; laser beam machining; solid lasers; dicing; direct writing on PCB; electronics packaging; gas lasers; silicon wafer; soldering mask; solid-state UV laser; via formation on PCB; Copper; Dielectric materials; Electronics packaging; Optical pulses; Silicon; Solid lasers; Solid state circuits; Space vector pulse width modulation; Sun; Writing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298716
Filename
1298716
Link To Document