Micro-holes in gold foils machined by excimer laser ablation

Author

Chen, Zhiling ; Liu, Sheng ; Shi, Tielin ; Liangcai Xion ; Qu, June ; Qiu, Yubin

Author_Institution

Inst. of Microsystems, Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

172

Lastpage

175

Abstract

Micro-holes in gold foils were machined by excimer laser ablation, to provide a useful micro-process for manufacturing a flat plane wire winding and transformer. The mechanisms of the excimer laser ablation were described. There are two classes of laser ablation mechanisms that are the excimer laser-induced thermodynamics process and the interaction process of photons, phonons and electrons generated by the laser plasma. In these experiments, the laser pulse energy, repetition frequency and pulse number were, respectively, set to 200-350 mJ, 50-150 Hz and 300-1000. We observed atomic force micrographs of holes in the gold foil. The thickness of the gold foil is 20-25 /spl mu/m. The diameter of the holes in the gold foil is 20-40 /spl mu/m.

Keywords

atomic force microscopy; electron-phonon interactions; excimer lasers; gold; laser ablation; micromachining; photon-electron interactions; thermodynamics; 20 to 25 micron; 20 to 40 micron; 200 to 350 mJ; 50 to 150 Hz; ArF; Au; atomic force micrographs; excimer laser ablation; flat plane transformer; flat plane wire winding; gold foil micro-holes; laser plasma; laser pulse energy; laser pulse repetition frequency; laser-induced thermodynamics process; micromachining; microprocess; photons/phonons/electrons interaction process; Electrons; Gold; Laser ablation; Machine windings; Manufacturing; Optical pulses; Phonons; Pulse transformers; Thermodynamics; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298718

Filename

1298718