• DocumentCode
    2989870
  • Title

    The brazing of metal-ceramic insulator package

  • Author

    Wangchen ; Chen, Chuanzhen ; Wangluning, Kai

  • fYear
    2003
  • fDate
    28-30 Oct. 2003
  • Firstpage
    204
  • Lastpage
    205
  • Abstract
    With the development of the IC technology, the metal-ceramic insulator package is widely used in IC packaging and gradually develop a series of products, which play an important role in package field. Despite the type of the package differ from each other, the basic structure is same. A metal-ceramic insulator is usually consist of a base, a frame, leads, solder and ceramic insulator which is produced by means of brazing. In following passage, it takes JF04F3 package as an example to make detailed introduction.
  • Keywords
    brazing; ceramic packaging; integrated circuit packaging; wetting; IC packaging; JF04F3 package; airtightness; furnace brazing; heat preservation; metal-ceramic insulator package; wetting; Ceramics; Cooling; Copper; Electronics packaging; Insulation; Integrated circuit packaging; Lead; Metal-insulator structures; Protection; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
  • Conference_Location
    Shanghai, China
  • Print_ISBN
    0-7803-8168-8
  • Type

    conf

  • DOI
    10.1109/EPTC.2003.1298726
  • Filename
    1298726