DocumentCode :
2989870
Title :
The brazing of metal-ceramic insulator package
Author :
Wangchen ; Chen, Chuanzhen ; Wangluning, Kai
fYear :
2003
fDate :
28-30 Oct. 2003
Firstpage :
204
Lastpage :
205
Abstract :
With the development of the IC technology, the metal-ceramic insulator package is widely used in IC packaging and gradually develop a series of products, which play an important role in package field. Despite the type of the package differ from each other, the basic structure is same. A metal-ceramic insulator is usually consist of a base, a frame, leads, solder and ceramic insulator which is produced by means of brazing. In following passage, it takes JF04F3 package as an example to make detailed introduction.
Keywords :
brazing; ceramic packaging; integrated circuit packaging; wetting; IC packaging; JF04F3 package; airtightness; furnace brazing; heat preservation; metal-ceramic insulator package; wetting; Ceramics; Cooling; Copper; Electronics packaging; Insulation; Integrated circuit packaging; Lead; Metal-insulator structures; Protection; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
Type :
conf
DOI :
10.1109/EPTC.2003.1298726
Filename :
1298726
Link To Document :
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