• DocumentCode
    2990009
  • Title

    X-ray inspection for electronic packaging latest developments

  • Author

    Maur, Friedhelm

  • Author_Institution
    feinfocus Rontgen-Syst. GmbH, Germany
  • fYear
    2003
  • fDate
    28-30 Oct. 2003
  • Firstpage
    235
  • Lastpage
    239
  • Abstract
    During the past few years, advances have been made in both in X-ray tube and detector technologies. The field of microfocus radioscopy has been established as an important testing process and has expanded into many new industrial applications that require quality control or process optimization. The first nanofocus and multifocus X-ray systems have become available with a focal spot of 5 micron. In the existing range of microfocus X-ray tubes, further improvements have been achieved as well, such as increased long term stability of intensity position constancy. Software, image processing and manipulation techniques have all progressed as well, allowing X-ray to become a formidable non-destructive inspection method for manufacturers in virtually every industry, especially those involved with Electronic Packaging.
  • Keywords
    X-ray imaging; X-ray tubes; electronics packaging; focusing; inspection; radiography; 3D capability; X-ray imaging; X-ray inspection; X-ray tubes; axial computed tomography; bond wire inspection; die attach void analysis; electronic packaging; image processing; intensity position constancy; long term stability; microfocus radioscopy; multifocus X-ray systems; nanofocus X-ray systems; nondestructive inspection method; process optimization; quality control; volume rendering; wafer bump inspection; Application software; Electrical equipment industry; Electronics packaging; Industrial control; Inspection; Quality control; Testing; X-ray detection; X-ray detectors; X-ray imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
  • Conference_Location
    Shanghai, China
  • Print_ISBN
    0-7803-8168-8
  • Type

    conf

  • DOI
    10.1109/EPTC.2003.1298731
  • Filename
    1298731