DocumentCode
2990009
Title
X-ray inspection for electronic packaging latest developments
Author
Maur, Friedhelm
Author_Institution
feinfocus Rontgen-Syst. GmbH, Germany
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
235
Lastpage
239
Abstract
During the past few years, advances have been made in both in X-ray tube and detector technologies. The field of microfocus radioscopy has been established as an important testing process and has expanded into many new industrial applications that require quality control or process optimization. The first nanofocus and multifocus X-ray systems have become available with a focal spot of 5 micron. In the existing range of microfocus X-ray tubes, further improvements have been achieved as well, such as increased long term stability of intensity position constancy. Software, image processing and manipulation techniques have all progressed as well, allowing X-ray to become a formidable non-destructive inspection method for manufacturers in virtually every industry, especially those involved with Electronic Packaging.
Keywords
X-ray imaging; X-ray tubes; electronics packaging; focusing; inspection; radiography; 3D capability; X-ray imaging; X-ray inspection; X-ray tubes; axial computed tomography; bond wire inspection; die attach void analysis; electronic packaging; image processing; intensity position constancy; long term stability; microfocus radioscopy; multifocus X-ray systems; nanofocus X-ray systems; nondestructive inspection method; process optimization; quality control; volume rendering; wafer bump inspection; Application software; Electrical equipment industry; Electronics packaging; Industrial control; Inspection; Quality control; Testing; X-ray detection; X-ray detectors; X-ray imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298731
Filename
1298731
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