Title :
Unique new packaging of semiconductor packaging technology high performation by encapsulation epoxy resin and VPES (vacuum printing encapsulation systems)
Author_Institution :
Sanyu Rec Co., Ltd
Keywords :
Encapsulation; Epoxy resins; Printing; Semiconductor device packaging; Vacuum systems; Vacuum technology;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298733
