DocumentCode :
2990056
Title :
Fabrication of a Single Carbon Nano Tube for use in Nanolithography of MOSFET Gate
Author :
Karamdel, J. ; Talebi, N. ; Sattari, M. ; Derakhshandeh, J. ; Ayatollahi, F.L. ; Farrokhi, A. ; Hadi, A.R.
Author_Institution :
Islamic Azad Univ., Tehran
fYear :
2006
fDate :
Oct. 29 2006-Dec. 1 2006
Firstpage :
122
Lastpage :
126
Abstract :
Vertically aligned carbon nanotubes were grown by DC-PECVD on (100) cleaned Si using a mixture of Methane and hydrogen as the feed gases. For having single and small CNTs, we have used a refinement process, by means a seed layer is patterned by the standard lithography method. It forms islands of Cobalt for subsequent growth of nanotubes. By consecutive repetition of exposure/growth steps single and isolated islands of cobalt can be formed so that single standing vertical tubes are fabricated. The grown nanotubes are encapsulated by an insulating TiO2 layer and in result; Straight lines with width between 40 to 120 nm have been successfully drawn by these CNTs. The applied voltage between anode and cathode for electron emission from CNTs is 100 volts in 100 mum distance. This technique has been applied on P-type 00(100) silicon substrates for the formation of the gate region of N- MOSFET devices. The resulted transistor has a drive current of 286 muA/ mu m in VGs=250 mV and a maximum gm equal to 2100 mS/mm with sub-threshold slope of 100 mv/decade.
Keywords :
MOSFET; carbon nanotubes; plasma CVD; semiconductor device manufacture; semiconductor growth; titanium compounds; DC PECVD; MOSFET gate; TiO2; nanolithography; single carbon nano tube; size 40 nm to 120 nm; standard lithography method; voltage 100 V; voltage 250 mV; Carbon nanotubes; Cobalt; Fabrication; Feeds; Gases; Hydrogen; Insulation; Lithography; MOSFET circuits; Nanolithography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
Type :
conf
DOI :
10.1109/SMELEC.2006.381032
Filename :
4266582
Link To Document :
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