Experimental research on a coupling shock absorber for reinforcement of electronic-packaging component or MEMS

Author

Ping, Yang

Author_Institution

Dept. of Electron. Machinery, Guilin Inst. of Electron. Technol., China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

275

Lastpage

277

Abstract

A multi-medium micro-coupling shock absorber is designed through coupling the air, oil, rubber and metallic elastic component by ingenious tactics for the demands of resisting violent impact and attenuating vibration in vibration-impact-safety of electronic-packaging components or MEMS. Multi-parameter coupling experimental study of the impact mechanical characteristics of the coupling shock absorber is developed. The results show that the key-model machine has a good performance for resisting violent impact and strongly nonlinear dynamic characteristics. The controllable design-capability of the shock absorber is studied by changing of the parameters. So the research results lay an experimental base for future research of engineering design for resisting violent impact in vibration-impact-safety of electronic-packaging components or MEMS.

Keywords

electronics packaging; impact (mechanical); impact testing; micromechanical devices; shock control; vibration control; MEMS reinforcement; air elastic component; controllable design-capability; coupling shock absorber; electronic-packaging component reinforcement; engineering design; impact mechanical characteristics; key-model machine; metallic elastic component; multi-medium micro-coupling shock absorber; oil elastic component; rubber elastic component; strongly nonlinear dynamic characteristics; vibration attenuation; vibration-impact-safety; violent impact; Damping; Design engineering; Isolators; Micromechanical devices; Orifices; Petroleum; Rubber; Shock absorbers; Springs; Vibrations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298739

Filename

1298739