Title :
New fluorinated polyimides for advanced microelectronic applications
Author :
Liu, Jingang ; He, Min-hui ; Ge, Zi-yi ; Fan, Lin ; Yang, Shiyong
Author_Institution :
Inst. of Chem., Acad. Sinica, Beijing, China
Abstract :
A series of fluorinated polyimide films have been prepared by casting the poly (amic acid) solution, which were synthesized by polycondensation of 4,4-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) with various fluorinated aromatic diamines, including 1,4-bis (4-amino-2-trifluoromethylphenoxy) benzene (p6FPB), 4-[3\´, 5\´-bis-(trifluoromethyl) phenyl]-2,6-bis (4"-amino-phenyl) pyridine (pTFPP) and 4-[3\´,5\´-bis-(trifluoromethyl phenyl)-2,6-bis (3"-aminophenyl) pyridine] (mTFPP), followed by thermal imidization at elevated temperatures. The strong and flexible polyimide films, PI-1 (6FDA-p6FPB), PI-2 (6FDA-pTFPP) and PI-3 (6FDA-mTFPP) exhibited good thermal stability and high mechanical properties. The films also showed high surface and volume resistances and low dielectric constant. The excellent combined properties of the materials make them great candidates for microelectronic packaging.
Keywords :
condensation; dielectric thin films; electric resistance; integrated circuit packaging; permittivity; plastic packaging; polymer films; surface resistance; 1,4-bis (4-amino-2-trifluoromethylphenoxy) benzene; 4,4-(hexafluoroisopropylidene) diphthalic anhydride; 4-[3\´,5\´-bis-(trifluoromethyl phenyl)-2,6-bis (3"-aminophenyl) pyridine]; 4-[3\´,5\´-bis-(trifluoromethyl) phenyl]-2,6-bis (4"-amino-phenyl) pyridine; dielectric constant; fluorinated aromatic diamines; fluorinated polyimides; mechanical properties; microelectronic applications; poly (amic acid) solution casting; strong flexible polyimide films; surface resistances; thermal imidization temperatures; thermal stability; volume resistances; Dielectric constant; Dielectric materials; Electronic packaging thermal management; Laboratories; Mechanical factors; Microelectronics; Polyimides; Polymer films; Temperature; Thermal decomposition;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298747
