Researches on system quality control of materials and components for high density packaging

The reliability of the whole electronic system is determined by the electronic devices, components and materials and especially the application properties of materials is the base of high reliability. Failure analysis of electronic packaging shows that failure usually occurs at the interconnections of dissimilar materials. With the development of IC towards high density, high speed, and small size, there is a strong demand for the high performance microelectronic materials, especially for the physical and chemical properties of surfaces, which are the most important for high reliabilities. This paper systematically study the application properties of materials such as leadframe, LTCC substrate, Al anodized oxidation substrate, paste, solder, bump.