Water absorption and corrosion protection of esterified novolac resin cured epoxy resins applicable for microelectronics packing

Author

Li, Shanjun ; Tang, Xiaolin ; Ding, Yifu ; Liu, Mojun

Author_Institution

Minist. of Educ., Fudan Univ., Shanghai, China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

343

Lastpage

344

Abstract

In the present work, to study the effects of side group on water absorption, a series of novolac epoxy resins was cured with esterified a phenol novolac resin and phenol novolac resins separately. Thus, the hydroxyl group of phenol novolac resin was replaced by CH/sub 3/COO- group, C/sub 3/H/sub 7/COO/spl rho/oup and C/sub 6/H/sub 5/CH/sub 2/COO- group, and the cured resins were named as EP, EPA, EPB and EPP, respectively. FTIR showed that there were no hydroxyl groups but ester functional groups in the cured resins cured. with the esterified phenol novolac resins. The influence of the side groups on the water absorption behavior of the cured epoxy resins was investigated using gravimetric method, DSC, and corrosion test.

Keywords

Fourier transform spectra; corrosion protection; curing; differential scanning calorimetry; encapsulation; infrared spectra; plastic packaging; polymer films; sorption; DSC; FTIR spectra; corrosion protection; encapsulation; ester functional groups; esterified novolac resin cured epoxy resins; glass transition temperature; microelectronics packaging; side group effects; water absorption; Absorption; Corrosion; Curing; Epoxy resins; Mechanical factors; Microelectronics; Moisture; Protection; Temperature; Water;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298756

Filename

1298756