Title :
A preliminary research on the dehumidify technology of BGA
Author_Institution :
Xi´´an Inst. of Navigation Technol., China
Abstract :
A BGA is very susceptible to humidity and it should be used within eight hours of unpacking, but this is almost impossible in practical production. After carrying out a pre-dealing experiment on humidified BGAs, we come to the conclusion that a BGA which has been unpacked and remained in the air for more than eight hours must be dehumidified by means of being baked for 40 hours at a temperature of 125/spl deg/C in an oven.
Keywords :
ball grid arrays; environmental degradation; heat treatment; humidity; integrated circuit packaging; integrated circuit reliability; 125 degC; 40 h; BGA dehumidification technology; BGA humidity susceptibility; air exposed package; humidified BGA; oven baking temperature; pre-dealing experiment; reliability test; unpacked BGA; Electronics packaging; Humidity; Lead; Machining; Navigation; Ovens; Production; Reflow soldering; Surface-mount technology; Temperature;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298758
