• DocumentCode
    2990488
  • Title

    Analysis of error in measurement during destructive double bond pull test

  • Author

    Huang, Qiang ; Liu, Ying ; Guo, Daqi ; Ding, Rongrheng ; Zhang, Guohua

  • Author_Institution
    Packaging Res. Center, Wuxi Microelectron. Inst., China
  • fYear
    2003
  • fDate
    28-30 Oct. 2003
  • Firstpage
    360
  • Lastpage
    361
  • Abstract
    In the destructive double bond test, the experimental results are directly related to the position of the hook and the wire height. But no strict stipulation can be found in GB of MIL-STD. In this article, the effects of the two factors mentioned above on the experimental results are discussed detailedly. It was found that the error in measurement will be -5/spl sim/0% when the greatest wire loop angle /spl theta/ is 120 degree and the hook is put in the center of the wire with accuracy of /spl plusmn/10%. But the error will reach 20/spl sim/29% as /spl theta/ turns to be 100 degree. In order to minimize the error in measurement, ocular micrometer with surveyor´s rod can be used to control the position of the hook, and it was also suggested that the greatest wire loop angle, which is not specified in corresponding standard, should serve as an important control criterion.
  • Keywords
    adhesion; lead bonding; measurement errors; mechanical testing; destructive double bond pull test; hook position; measurement error; ocular micrometer; pulling force; wire bond strength; wire height; wire loop angle; Bonding; Error analysis; Error correction; Force measurement; Length measurement; Microelectronics; Packaging; Position measurement; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
  • Conference_Location
    Shanghai, China
  • Print_ISBN
    0-7803-8168-8
  • Type

    conf

  • DOI
    10.1109/EPTC.2003.1298760
  • Filename
    1298760