Title :
Challenges and advances in use-condition-based mechanical reliability test development
Author :
Mercado, Lei L. ; Sahasrabudhe, Shubhada ; Monroe, Eric
Abstract :
With rapid advances in the electronic packaging technology, reliability tests based on field conditions have become essential to the package reliability assessment. This paper discusses some major challenges and recent advances in both the assembly and end use condition characterizations and reliability test development.
Keywords :
electronics packaging; integrated circuit reliability; mechanical testing; semiconductor device reliability; acceptance criterion; assembly condition; component robustness; cycles to failure; electronic packaging; end use condition; field conditions; mechanical reliability test; use-condition-based test; Assembly; Capacitive sensors; Electronic equipment testing; Electronics packaging; Failure analysis; Fatigue; Semiconductor device manufacture; Soldering; Temperature; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298762
