DocumentCode
2990750
Title
TMPL: A hardware transactional memory product line
Author
Meier, Matthias ; Austin, David ; Schirmeier, Horst ; Spinczyk, Olaf
Author_Institution
Embedded Syst. Software - Comput. Sci. 12, Tech. Univ. Dortmund, Dortmund, Germany
fYear
2011
fDate
4-8 July 2011
Firstpage
539
Lastpage
546
Abstract
Transactional memory is regarded as a very promising technology to deal with concurrency control in future multicore and manycore systems. While a lot of software, hardware, and hybrid transactional memory implementations have been proposed and analyzed, the silver bullet still hasn´t been found. The main reason is that the performance of transactional memory significantly depends on the actual application scenario. TMPL is a product line of transactional memory implementations for configurable hardware platforms, mainly aimed at the domain of embedded systems. It facilitates the derivation of various kinds of transactional memory with a large variety of strategies for conflict detection, conflict resolution, and versioning, from a common platform. Thereby, developers can experiment with different strategies and select one that is most efficient for a given workload profile. This paper presents the underlying product line development process, TMPL´s structure, and an early quantitative evaluation of our FPGA-based implementation.
Keywords
concurrency control; embedded systems; field programmable gate arrays; multiprocessing systems; parallel memories; storage management; transaction processing; FPGA; TMPL; concurrency control; configurable hardware platforms; embedded systems; hardware product line; manycore systems; multicore systems; product line development process; transactional memory; Data structures; Field programmable gate arrays; Hardware; Memory management; Programming; Software; Domain Analysis; FPGA; Hardware Product Line; Hardware Transactional Memory; MPSoC;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Computing and Simulation (HPCS), 2011 International Conference on
Conference_Location
Istanbul
Print_ISBN
978-1-61284-380-3
Type
conf
DOI
10.1109/HPCSim.2011.5999872
Filename
5999872
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