Title :
Reliability analysis in IC package
Author :
He, Ping ; Peng, Yaowei ; Gu, Jing ; Wang, Jun ; Yu, Hongkun ; Ni, Jinfeng ; Qian, Ziyong ; Wang, Jiaji
Author_Institution :
Dept. of Mater. Sci., Fudan Univ., Shanghai, China
Abstract :
In developing IC packaging, the study of failure mechanisms is very important for the production process and the device usage process. Many researchers have made contributions to this field. In this paper, some work related to reliability analysis carried out in Fudan University is reviewed and, in addition, further research topics are discussed.
Keywords :
failure analysis; integrated circuit packaging; integrated circuit reliability; IC package reliability analysis; IC packaging; device usage process; failure analysis; failure mechanisms; production process; Capacitive sensors; Delamination; Fatigue; Integrated circuit packaging; Plastics; Production; Soldering; Temperature; Testing; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298781
