Title :
Application of temporary solder mask in SMT of high frequency circuit boards
Author_Institution :
China Electron. Technol. Group Corp. No.38TH, Res. Inst. HeFei, China
Abstract :
A high frequency PCB (printed circuit board) can not be coated with solder mask, because solder mask on a PCB, acting as a kind of dielectric, greatly affects the electronic characteristics of high frequency circuits. But, the soldering of SMD (surface mounted devices) on a PCB with no solder mask brings on many problems during assembly, such as lack of solder in solder joints, components soldered onto the PCB which are skew, are away from solder pads, or stand up like tombstones. Now, we can use a temporary solder mask to solve all these problems.
Keywords :
assembling; masks; printed circuit manufacture; reflow soldering; surface mount technology; SMD soldering; SMT; assembly; component skew; high frequency PCB; solder deficient joints; solder mask dielectric properties; surface mounted devices; temporary solder mask; tombstoning; Assembly; Curing; Dielectrics; Frequency; Polymers; Printed circuits; Soldering; Solvents; Surface tension; Surface-mount technology;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298782
