DocumentCode
2991042
Title
Application of temporary solder mask in SMT of high frequency circuit boards
Author
Wei-cheng, Lin
Author_Institution
China Electron. Technol. Group Corp. No.38TH, Res. Inst. HeFei, China
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
467
Lastpage
470
Abstract
A high frequency PCB (printed circuit board) can not be coated with solder mask, because solder mask on a PCB, acting as a kind of dielectric, greatly affects the electronic characteristics of high frequency circuits. But, the soldering of SMD (surface mounted devices) on a PCB with no solder mask brings on many problems during assembly, such as lack of solder in solder joints, components soldered onto the PCB which are skew, are away from solder pads, or stand up like tombstones. Now, we can use a temporary solder mask to solve all these problems.
Keywords
assembling; masks; printed circuit manufacture; reflow soldering; surface mount technology; SMD soldering; SMT; assembly; component skew; high frequency PCB; solder deficient joints; solder mask dielectric properties; surface mounted devices; temporary solder mask; tombstoning; Assembly; Curing; Dielectrics; Frequency; Polymers; Printed circuits; Soldering; Solvents; Surface tension; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298782
Filename
1298782
Link To Document