Title :
Laser ink-jet solder bump fabrication for electronic interconnection
Author :
Li, Fuquan ; Wang, Chunqing ; Tian, Yanhong
Author_Institution :
Nat. key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol., China
Abstract :
With the development of fine-pitch electronic interconnection, solder bump fabrication is becoming more and more important. Many bumping technologies have been developed. We can see the existing method has its merits as well as demerits. In this paper, we introduced laser ink-jet solder bump technology. The tests have shown that this method has distinctive merits. Selecting the appropriate parameters, we can produce appropriate solder bumps.
Keywords :
fine-pitch technology; ink jet printers; integrated circuit interconnections; integrated circuit packaging; jets; laser deposition; spray coating techniques; LUT; MJT; electronic interconnection; electrostatically guided printing; fine-pitch interconnection; laser ink-jet solder bump fabrication; metal jet technology; Atmosphere; Costs; Electronics packaging; Gas lasers; Optical control; Optical device fabrication; Optical pulses; Size control; Temperature; Wire;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298784
