DocumentCode :
2991139
Title :
Recent developments of direct bonded copper (DBC) substrates for power modules
Author :
Schulz-Harder, Juergen ; Exel, Karl
Author_Institution :
curamik(R) electronics gmbh, Germany
fYear :
2003
fDate :
28-30 Oct. 2003
Firstpage :
491
Lastpage :
496
Abstract :
DBC substrates are the standard circuit boards for power modules. Using DBC technology, thick copper foils (0.125 mm-0.7 mm) are cladded to alumina or aluminum nitride. The strong adhesion of the copper to ceramic bond reduces the thermal expansion coefficient (TEC) in the horizontal direction only slightly above the TEC of the ceramic itself. This allows direct silicon attach of large dies without using TEC controlling layers. As DBC technology is using copper foils, integral leads overhanging the ceramic can be realized. A new via technology, combined with integrated leads, allows the design of low weight hermetic packages with improved thermal performance. High end multichip modules with extremely low thermal resistance (<0.03 K/W) can be achieved by the integration of 3D micro channels for liquid cooling underneath the power circuit area. A new type of alumina DBC with a flexural strength of >1000 MPa and excellent temperature cycling resistance has been developed.
Keywords :
adhesion; aluminium compounds; bending strength; bonding processes; ceramic packaging; cooling; copper; foils; microassembling; multichip modules; power electronics; substrates; thermal expansion; thermal resistance; 0.125 to 0.7 mm; 1000 MPa; 3D micro channels; Cu-Al/sub 2/O/sub 3/; Cu-AlN; DBC technology; copper/ceramic bond adhesion; direct bonded copper substrates; flexural strength; integral overhanging leads; large die attach; liquid cooling; low weight hermetic packages; multichip modules; multichip power semiconductor devices; power module circuit boards; temperature cycling resistance; thermal expansion coefficient; thermal resistance; thick copper foils; via technology; Adhesives; Aluminum nitride; Bonding; Ceramics; Copper; Multichip modules; Printed circuits; Silicon; Thermal expansion; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
Type :
conf
DOI :
10.1109/EPTC.2003.1298787
Filename :
1298787
Link To Document :
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