Title :
Vertical signal transmission in three-dimensional integrated circuits by capacitive coupling
Author :
Kühn, Stefan A. ; Kleiner, Michael B. ; Thewes, Roland ; Weber, Werner
Author_Institution :
Siemens AG, Munich, Germany
fDate :
30 Apr-3 May 1995
Abstract :
In this paper, methods for direct vertical transmission of digital signals between adjacent chiplayers in three-dimensional circuit structures are presented. Alternative circuit schemes are investigated and compared to state-of-the-art structures with respect to signal delay and power dissipation. Improvements of over 30% in terms of speed and up to an order of magnitude in terms of dynamic power dissipation are achievable. Analytical calculations, simulations and experimental results show the suitability of the architectures for vertical signal transmission of high bandwidth digital information
Keywords :
VLSI; circuit analysis computing; comparators (circuits); coupled circuits; delays; digital signal processing chips; receivers; 0.5 mum; 3.3 V; analytical calculations; capacitive coupling; comparator; digital signal transmission; dynamic power dissipation; high bandwidth digital information; receiver architecture; signal delay; simulations; three-dimensional integrated circuits; vertical signal transmission; Capacitance; Coupling circuits; Delay; Digital integrated circuits; Hysteresis; Latches; Power dissipation; Pulse amplifiers; Signal processing; Three-dimensional integrated circuits;
Conference_Titel :
Circuits and Systems, 1995. ISCAS '95., 1995 IEEE International Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-2570-2
DOI :
10.1109/ISCAS.1995.521445
