Title :
A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System
Author :
Ahmad, I. ; Jiun, Hoh Huey ; Leng, Eu Poh ; Majlis, B.Y. ; Mar, Alan ; Wagiran, R.
Author_Institution :
Univ. Kebangsaan Malaysia, Bangi
fDate :
Oct. 29 2006-Dec. 1 2006
Abstract :
This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that lwt%Ag 0.5wt% Cu has larger melting range compared to 3 & 4wt%Ag 0.5wt%Cu which could contribute to IMC growth. Relatively, ball shear results shows that shear strength increases with Ag wt% content. A correlation between melting range and shear results made in this study pointed to 3.8wt%Ag0.5wt%Cu having the most favorable results.
Keywords :
copper alloys; differential scanning calorimetry; melting point; shear strength; silver alloys; solders; tin alloys; C5 solder bumps; IMC growth; SnAgCu; differential scanning calorimetry; inter-metallic compound formation; inter-metallic compound strength; lead free SnAgCu solder system; shear strength measurement; solder clad; solder shear strength; solders melting behavior; Aluminum alloys; Electronics packaging; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Morphology; Temperature; Testing; Tin; Vehicles;
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
DOI :
10.1109/SMELEC.2006.380690
