DocumentCode
2992081
Title
An FIB Method Using Progressive Multi-Cut Technique & Application in Failure Analysis of Wafer Fabrication
Author
Hong, Khoo Ley ; Younan, Hua ; Siping, Zhao ; Zhiqiang, Mo
Author_Institution
Chartered Semicond. Mfg Ltd, Singapore
fYear
2006
fDate
Oct. 29 2006-Dec. 1 2006
Firstpage
591
Lastpage
593
Abstract
In this paper, an FIB method using progressive multi-cut technique is proposed and it has been applied in failure analysis of wafer fabrication. The application results showed that this method would greatly improve FIB cut success rate, especially for invisible defects. A case study on Vbd ramp up failure after QBD short loop will be presented.
Keywords
cutting; failure analysis; focused ion beam technology; semiconductor device manufacture; sputter etching; QBD short loop; failure analysis; focused ion beam; progressive multicut technique; wafer fabrication; Cleaning; Design for quality; Fabrication; Failure analysis; Milling; Platinum; Protection; Silicon; Textile industry; Wood industry;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
0-7803-9730-4
Electronic_ISBN
0-7803-9731-2
Type
conf
DOI
10.1109/SMELEC.2006.380700
Filename
4266683
Link To Document