Title :
High efficiency 850 nm Vertical-Cavity Surface-Emitting Laser using fan-pad metallization and trench patterning
Author :
Mohd Sharizal Alias ; Leisher, Paul O. ; Choquette, Kent D. ; Sahbuddin Shaari
Author_Institution :
Optoelectronic Device Cluster, Microelectronic & Nanotechnology Program, Telekom Malaysia Research & Development (TMR&D), UPM-MTDC, Lebuh Silikon, Serdang, Selangor, 43400 Malaysia
Abstract :
In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.
Keywords :
Fiber lasers; Metallization; Mirrors; Optical fiber LAN; Optical surface waves; Oxidation; Semiconductor device packaging; Semiconductor lasers; Surface emitting lasers; Vertical cavity surface emitting lasers;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Conference_Location :
Penang, Malaysia
Print_ISBN :
978-1-4244-3392-6
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2008.5507777
