Title :
Optimized conditions to make stable free air ball(FAB) for copper bonding wire
Author :
Kim, S.H. ; Park, H.W. ; Moon, J.T.
Author_Institution :
MK Electron Co., Ltd., 316-2, Kumeru-ri, Pogok-eup, Cheoin-gu Yongin, Gyeonggi-do, Korea, 449-812
Abstract :
Recently Gold price is increased much higher. So Copper wire as low cost solution, is highlighted in various package groups. And some packages having low-pin count of thick size wire, have already been succeeded in mass production using Copper wire. If high Gold price is being kept continuously, speed of conversion for Copper wire will be accelerated.
Keywords :
Bonding; Copper; Electrons; Fluid flow; Gold; Moon; Oxidation; Packaging; Shape control; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Conference_Location :
Penang, Malaysia
Print_ISBN :
978-1-4244-3392-6
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2008.5507781
