Title :
Investigation and Failure Analysis of "Flower-like" Defects on Microchip Aluminum Bondpads in Wafer Fabrication
Author :
Younan, Hua ; Kheng, Lim Yeow ; Siping, Zhao ; Ramesh, Rao ; Boon, Tan Juan
Author_Institution :
Chartered Semicond. Manuf. Ltd., Singapore
fDate :
Oct. 29 2006-Dec. 1 2006
Abstract :
In this paper, Al fluoride defects on microchip Al bondpads were studied, which were confirmed to be due to a 12 hours delay prior to NE111 clean process. Failure analysis results and mechanism were discussed. Moreover, a preventive solution of introducing a time link between passivation etch and NE111 clean process was recommended and implemented.
Keywords :
aluminium compounds; cleaning; etching; failure analysis; passivation; semiconductor device manufacture; Al fluoride defects; NE111 clean process; failure analysis; flower-like defects; microchip aluminum bondpads; passivation etch; wafer fabrication; Aluminum; Coatings; Contamination; Delay; Electrons; Fabrication; Failure analysis; Measurement standards; Voltage; Wafer bonding;
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
DOI :
10.1109/SMELEC.2006.380708
