• DocumentCode
    2992231
  • Title

    Investigation and Failure Analysis of "Flower-like" Defects on Microchip Aluminum Bondpads in Wafer Fabrication

  • Author

    Younan, Hua ; Kheng, Lim Yeow ; Siping, Zhao ; Ramesh, Rao ; Boon, Tan Juan

  • Author_Institution
    Chartered Semicond. Manuf. Ltd., Singapore
  • fYear
    2006
  • fDate
    Oct. 29 2006-Dec. 1 2006
  • Firstpage
    626
  • Lastpage
    629
  • Abstract
    In this paper, Al fluoride defects on microchip Al bondpads were studied, which were confirmed to be due to a 12 hours delay prior to NE111 clean process. Failure analysis results and mechanism were discussed. Moreover, a preventive solution of introducing a time link between passivation etch and NE111 clean process was recommended and implemented.
  • Keywords
    aluminium compounds; cleaning; etching; failure analysis; passivation; semiconductor device manufacture; Al fluoride defects; NE111 clean process; failure analysis; flower-like defects; microchip aluminum bondpads; passivation etch; wafer fabrication; Aluminum; Coatings; Contamination; Delay; Electrons; Fabrication; Failure analysis; Measurement standards; Voltage; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    0-7803-9730-4
  • Electronic_ISBN
    0-7803-9731-2
  • Type

    conf

  • DOI
    10.1109/SMELEC.2006.380708
  • Filename
    4266691
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2992231