Title :
Process development of fast-cure low stress lid adhesive for microprocessors
Author :
Kee-Hean Keok ; Sean Too ; Jacquana Diep ; Quah Hong Tat ; Arai Fumihiro ; Kim Le
Author_Institution :
Advanced Micro Devices Export Sdn Bhd, Bayan Lepas FTZ, Phase 3, Penang, Malaysia
Abstract :
A lid or heat spreader is used for packaging microprocessor chips. There are two primary functions for the lid: dissipate heat efficiently from the microprocessor and provide physical protection to the fragile silicon chip.
Keywords :
Adhesives; Assembly; Bonding; Copper; Heat sinks; Microprocessors; Packaging; Silicon; Temperature; Thermal stresses;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Conference_Location :
Penang, Malaysia
Print_ISBN :
978-1-4244-3392-6
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2008.5507786
