• DocumentCode
    2992419
  • Title

    Pressure sensors based on MEMS, operating in harsh environments (touch-mode)

  • Author

    Hezarjaribi, Y. ; Hamidon, M. N. ; Bahadorimehr, A. R.

  • Author_Institution
    Golestan University, Gorgan, Iran
  • fYear
    2008
  • fDate
    4-6 Nov. 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In this paper, Poly-crystalline silicon carbide (poly-sic) Micro-electromechanical systems (MEMS) capacitive pressure sensor operating in harsh environment in touch mode is proposed, The principle of the paper is to design, obtain analytical solution and compare the results with the simulation for a circular diaphragm deflection before and after touch point. The sensor demonstrated a high temperature sensing capability up to 400° C, the device achieves a linear characteristic response and consists of a circular clamped-edges poly-sic diaphragm suspended over sealed cavity on a silicon carbide substrate. The sensor is operating in touch mode capacitive pressure sensor, The advantages of a touch mode are the robust structure that make the sensor to withstand harsh environment, near linear output, and large over-range protection, operating in wide range of pressure, higher sensitivity than the near linear operation in normal mode, The material is considered to be used for harsh environment is SiC (Silicon Carbide), Because of SiC owing excellent electrical stability, mechanical robustness, and chemical inertness properties and the application of pressure sensors in harsh environments are, such as automotive industries, aerospace, oil/logging equipments, nuclear station, and power station. We are simulating MEMS capacitive pressure sensor to optimize the design, improve the performance and reduce the time of fabricating process of the device. The proposed touch mode MEMS capacitive pressure sensor demonstrated diaphragm ranging from 150µm to 360µmin diameter, with the gap depth from 0.5µm to 7.5µmand the sensor exhibit a linear response with pressure from 0.05 Mpa to 10 Mpa.
  • Keywords
    Aerospace materials; Capacitive sensors; Chemical sensors; Mechanical sensors; Micromechanical devices; Robust stability; Sensor phenomena and characterization; Silicon carbide; Tactile sensors; Temperature sensors; Micro-electromechanical systems (MEMS); Touch mode Capacitive pressure sensor; harsh environment; high-temperature; poly-crystalline silicon carbide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
  • Conference_Location
    Penang, Malaysia
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-3392-6
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2008.5507791
  • Filename
    5507791