DocumentCode
2992601
Title
Failure Analysis of A Unique Poly Defect
Author
Neo, S.P. ; Song, Z.G. ; Oh, C.K. ; Zhao, S.P.
Author_Institution
Chartered Semicond. Manuf. Ltd., Singapore
fYear
2006
fDate
Oct. 29 2006-Dec. 1 2006
Firstpage
696
Lastpage
698
Abstract
To successfully identify the root cause of a failure, it is required to have systematic failure analysis approaches with the right techniques and to make detailed observation during the course of analysis. In this paper, detailed failure analysis has been present to identify the root cause of a unique poly defect through taking the right approaches and techniques.
Keywords
failure analysis; semiconductor devices; semiconductor devices; systematic failure analysis; unique poly defect identification; Etching; Failure analysis; Feedback; Manufacturing processes; Oxidation; Performance analysis; Semiconductor devices; Silicon compounds; Tungsten; Wood industry;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
0-7803-9730-4
Electronic_ISBN
0-7803-9731-2
Type
conf
DOI
10.1109/SMELEC.2006.380725
Filename
4266708
Link To Document