DocumentCode :
299263
Title :
Combining RC-interconnect effects with nonlinear MOS macromodels
Author :
Kong, Jeong-Taek ; Overhauser, David
Author_Institution :
Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
Volume :
1
fYear :
1995
fDate :
30 Apr-3 May 1995
Firstpage :
570
Abstract :
This paper presents new techniques for accurately accounting for RC-interconnect effects in conjunction with nonlinear MOS macromodeling. RC-interconnects contribute to the delay of signals, but more importantly, they alter the shape of signals. Thus, circuit performance is affected by nonlinear transistors, secondary MOS effects, input waveform shape, and RC-interconnect loading. All these issues are addressed by the techniques presented here. An equivalent π-model for RC-interconnects is used in combination with advanced nonlinear MOS macromodeling to provide simulation results with accurate timing and, more critically, waveform shape of the gate output. Thus, the macromodel provides accurate simulation results whether the behavior is dominated by the nonlinear transistors or RC-interconnects. These techniques yield accurate circuit behavior at speeds two orders of magnitude faster than SPICE for even small circuits
Keywords :
CMOS integrated circuits; RC circuits; circuit analysis computing; delays; driver circuits; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; nonlinear network analysis; timing; waveform analysis; CMOS gates; RC-interconnect effects; RC-interconnect loading; VLSI circuits; circuit performance; equivalent π-model; input waveform shape; nonlinear MOS macromodels; nonlinear driver; nonlinear transistors; secondary MOS effects; signal delay; signal shape alteration; simulation; timing; Circuit simulation; Delay estimation; Driver circuits; Integrated circuit interconnections; Resistors; SPICE; Shape; Transistors; Very large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 1995. ISCAS '95., 1995 IEEE International Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-2570-2
Type :
conf
DOI :
10.1109/ISCAS.1995.521577
Filename :
521577
Link To Document :
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