DocumentCode :
2992733
Title :
Alignment Mark Architecture Effect on Alignment Signal Behavior in Advanced Lithography
Author :
Ahmad, Normah ; Hashim, Uda ; Manaf, Mohd Jeffery ; Abdul, K.I.
Author_Institution :
SilTerra Malaysia Sdn. Bhd., Kulim
fYear :
2006
fDate :
Oct. 29 2006-Dec. 1 2006
Firstpage :
732
Lastpage :
739
Abstract :
The downscaling of CMOS technology becomes a challenge to the scanner alignment system since overlay and alignment accuracy becomes tighter. Such a tight overlay requirement requires a very stable alignment performance. A stable alignment performance is indicates by a stable alignment signal generation. Hence, it is important to perform process characterization in order to choose an alignment mark, which generates the most stable signals. Different alignment mark type may show a different behavior in signal generation. In this paper, the signals behavior will be explored by experimenting using two different alignment mark architecture. This architecture can be further divided into three, which is AH32, AH53, and AH74. Based from the results, AH32 mark shows a significant trend difference between contact and metal mark. This is due to the fact AH32 contact mark is the easiest to be deformed since its feature size is the biggest compared to AH53 and AH74. AH53 and AH74 alignment signal performance between contact and metal mark are comparable.
Keywords :
CMOS integrated circuits; lithography; AH32; AH53; AH74; CMOS technology; advanced lithography; alignment mark architecture; alignment signal behavior; alignment signal performance; scanner alignment system; stable alignment signal generation; CMOS technology; Character generation; Etching; Lithography; Optical sensors; Planarization; Printing; Signal generators; Signal processing; Tungsten; Alignment mark; Alignment signal; lithography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
Type :
conf
DOI :
10.1109/SMELEC.2006.380732
Filename :
4266715
Link To Document :
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