DocumentCode :
2993087
Title :
Correlation method of circuit-performance and technology fluctuations for improved design reliability
Author :
Miyawaki, D. ; Matsumoto, S. ; Mattausch, H.J. ; Ooshiro, S. ; Suetake, M. ; Miura-Mattausch, M. ; Kumashiro, S. ; Yamaguchi, T. ; Yamashita, K. ; Nakayama, N.
Author_Institution :
Dept. of Electr. Eng., Hiroshima Univ., Japan
fYear :
2001
fDate :
2001
Firstpage :
39
Lastpage :
44
Abstract :
We propose a method of correlating circuit performance with technology fluctuations during the circuit-design phase. The method employs test circuits sensitive for technology fluctuations and a circuit simulation model, which enables one to interpret the correlation. We validate our proposal with a cascode-current-source test circuit and the drift-diffusion MOSFET model HiSIM. The chosen test circuit allows one to separate intra-chip and inter-chip technology fluctuations and to correlate these fluctuations with circuit-performance fluctuations. One important result is that intra-chip fluctuations increase faster than inter-chip fluctuations with decreasing gate length. Quantitative modeling with HiSIM reveals random fluctuation of the effective gate length as the most likely origin for these findings
Keywords :
correlation methods; fluctuations; integrated circuit design; integrated circuit modelling; integrated circuit reliability; HiSIM; cascode-current-source test circuit; circuit simulation model; circuit-design phase; circuit-performance fluctuations; correlation method; design reliability improvement; drift-diffusion MOSFET model; effective gate length fluctuations; inter-chip technology fluctuations; intra-chip technology fluctuations; random fluctuation; technology fluctuations; CMOS technology; Circuit simulation; Circuit testing; Correlation; Fluctuations; MOSFET circuits; Proposals; Semiconductor device measurement; Semiconductor device modeling; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2001. Proceedings of the ASP-DAC 2001. Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
0-7803-6633-6
Type :
conf
DOI :
10.1109/ASPDAC.2001.913278
Filename :
913278
Link To Document :
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